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Plasma Dicing 101, Part II | Innovation | KLA
Dicing takes place near the end of the semiconductor process flow. At this point the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. (Check out the first article in our Plasma Dicing 101 series, which compares traditional dicing methods such as blade and laser to plasma dicing).
Reflecting on 10 Years of The Karel Urbánek Best Student Paper Award | Innovation | KLA
Each year since 2013, SPIE announces The Karel Urbánek Best Student Paper Award in conjunction with the SPIE Advanced Lithography and Patterning Control Conference. To mark its 10th anniversary, award sponsor KLA asked the current winner and past recipients for their advice to students thinking about entering their research papers.
Vapor Etch Solutions for Releasing MEMS | Innovation | KLA
Microelectromechanical systems (MEMS) are miniaturized systems that can be challenging to make and are relatively fragile. Often smaller than 1 millimeter, MEMS are built into components found in the electronics, automotive, medical and communications industries.
Are Tiny MicroLEDs the Next Big Thing for Displays? | Innovation | KLA
KLA is proud to be part of the most significant technological breakthroughs that help create the devices and ideas that transform our current life and shape our future. One of the latest emerging trends is a renewed focus on microLED technology.
Compound Semiconductor Innovation Advances EVs and Other Green Technologies | Innovation | KLA
As the world works to reduce greenhouse gas emissions, global adoption of electric vehicles (EVs)is driving increased demand for high-power, energy-efficient semiconductors, such as silicon carbide (SiC)-based components throughout the entire EV assembly process.
Teron™ SL670e and Teron™ SL670e XP: EUV Reticle Quality Control | Innovation | KLA
Extreme ultraviolet (EUV) lithography is a key technology inflection for the semiconductor industry. While shifting the scanner wavelength to EUV has enabled printing of the smaller pattern features required for ≤5nm design node chips, it has also added tremendous complexity to the equipment, reticles, resists and other infrastructure required to support EUV lithography.
New Orbotech Corus™ Offers Double-Sided Imaging for High-Density Interconnect PCBs and IC Substrates | Innovation | KLA
The new Orbotech Corus™ 8M direct imaging (DI) system is the first solution built on KLA’s all-in-one revolutionary Orbotech Corus platform, combining optimized resolution, accuracy and efficiency for PCB manufacturers designing smaller, thinner devices for OEMs that pack ever-increasing functionality into increasingly small enclosures for high-end applications.